India’s First Advanced 3D Semiconductor Packaging Unit
Context:
In a defining moment for India's semiconductor ambitions and Odisha's emergence as a future-ready technology destination, the foundation stone for the country's first advanced 3D chip packaging unit was recently laid at Info Valley in Bhubaneswar, Odisha.
This groundbreaking project marks a significant milestone towards strengthening India’s domestic semiconductor ecosystem and advancing the broader national vision of 'Atmanirbhar Bharat' in high-end electronics manufacturing.
Details of the Facility:
The groundbreaking project is actively promoted by 3D Glass Solutions.
The facility itself will be operated under the entity Heterogeneous Integration Packaging Solutions Pvt. Ltd. (HIPSPL), situated in the Khordha district.
The plant is uniquely designed as a greenfield, vertically integrated advanced packaging and embedded glass substrate ATMP (Assembly, Testing, Marking, and Packaging) facility.
The total capital investment dedicated to the project is massive, standing at ₹1,943.53 crore.
To ensure its success, it is backed by an approved Central fiscal support of ₹799 crore, alongside additional State-level support of approximately ₹399.5 crore.
The plant has set a concrete timeline, with commercial production expected to officially begin by August 2028.
Following this, full-scale volume production is strategically targeted for August 2030.
Applications:
Emerging Technologies:
The high-end ATMP facility is built to explicitly cater to modern, high-growth sectors.
Its output will be vital for data centres, Artificial Intelligence (AI), machine learning, and next generation 5G/6G communications.
Furthermore, the advanced 3D semiconductor packaging will play a crucial role in sensitive and critical domains such as automotive radar, photonics, aerospace applications, and defence electronics.